Product Applications:
The ZY-H203L2-50K40 dual-chamber thermal shock test chamber (also known as a basket-type thermal shock chamber, hoist-type thermal shock chamber, or dual-chamber temperature shock test chamber) is a specialized environmental reliability testing device that uses an electric or pneumatic hoist to rapidly move samples between high-temperature and low-temperature zones, enabling instantaneous temperature switching. With its compact design, rapid transition, and high cost-effectiveness, it is the most widely used temperature shock testing equipment in the industry. It can subject samples to sudden temperature transitions from extremely low temperatures (as low as -80°C) to extremely high temperatures (as high as +200°C) in a very short time, simulating the severe thermal shocks products encounter during transportation, storage, and use. This allows for the detection of defects such as cracking, delamination, solder joint failure, electrical performance degradation, and seal failure in materials and components under thermal stress.
Common Testing Standards:
National Standards
| GB/T 2423.22-2012 | Environmental Testing of Electrical and Electronic Products—Test Methods for Temperature Changes | Test Na transition time ≤ 30 seconds; equivalent to IEC 60068-2-14 |
| GB/T 5170.2-2017 | Test Methods for Environmental Test Equipment for Electrical and Electronic Products | Equipment acceptance criteria (temperature deviation/uniformity/fluctuation) |
| GB/T 10592-2008 | Technical Requirements for High and Low Temperature Test Chambers | Temperature field uniformity and stability indicators |
International Standards
| IEC 60068-2-14 | Basic environmental tests—temperature variation | General for electrical and electronic products |
| MIL-STD-883K Method 1011 | Test Methods for Microelectronic Devices—Temperature Cycling | Gold standard in the semiconductor industry, naturally suited for dual-chamber systems |
| MIL-STD-202F | Testing of Electronic and Electrical Components—Temperature Shock | Military components |
| JESD22-A106B | Temperature Shock Testing for Semiconductor Devices | Commercial-Grade Semiconductors |
| ISO 16750-4 | Electrical and Electronic Equipment for Road Vehicles — Climatic Loads | Automotive Components |
Military Standards
| GJB 150.5A-2009 | Temperature Shock Testing for Military Equipment | Requires “test specimens must not move”; three-chamber configuration required |
| GJB 360B Method 107 | Temperature Shock Testing for Electronic Components | Compatible with two-chamber configuration, -55°C to +125°C |
Industry Standards
| RTCA DO-160G | Environmental Testing of Aerospace Equipment |
| IEC 61215 | Temperature Cycling Test for Photovoltaic Modules |
| VW 80000 | Volkswagen Supplier Standard |
Product Advantages:
Compact size and minimal footprint, with lower equipment costs and operating energy consumption, offering outstanding value for money.
Fast chamber switching speed to meet the requirements of rapid thermal shock testing.
Simple structure, low failure rate, and easy daily maintenance.
Suitable for general-purpose products such as electronics, plastics, hardware, and packaging.
Applications of Dual-Chamber Thermal Shock Test Chambers:
| Industry | Typical Test Samples | Failure Modes of Concern |
| Electronics & Electrical | PCBs, chips, connectors, relays, semiconductor devices | Solder joint cracking, delamination, electrical performance degradation |
| Consumer Electronics | Mobile phones, tablets, smart wearables, LEDs | Screen cracking, adhesive failure, button malfunction |
| Automotive Industry | Sensors, ECUs, in-vehicle modules, wiring harnesses, hardware components | Seal failure, solder joint detachment, plastic cracking |
| New Energy | Battery modules (small), BMS, battery cells | Battery swelling, electrical performance degradation |
| Materials/Hardware | Metal parts, plastic parts, rubber parts, adhesives | Cracking, deformation, reduced adhesion |
| Research Institutes | New material specimens, component samples | Comprehensive reliability assessment, life prediction |
| Packaging & Transportation | Packaging materials, container accessories | Structural integrity under thermal cycling |







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