FPC Bending Fatigue Tester ZY-FZ-C

Applications of the Fold Test Machine：

The FPC Bending Fatigue Tester is primarily used to simulate the stress conditions experienced by flexible substrates (such as FPCs, UTG glass, and graphene materials) during repeated bending, thereby determining the maximum number of folds before failure (0–99,999,999 cycles, presettable). This machine features a touchscreen interface for setup and display, performing repeated folding tests under specified conditions regarding the radius of the bending rod, number of cycles, speed, and angle. Test parameters such as the specimen’s orientation (longitudinal or transverse), tension level, test speed, and number of cycles can be configured according to specific testing requirements.

Core Technical Advantages：

1. This machine incorporates a conductivity testing module to monitor the electrical conductivity of flexible printed circuits in real time during dynamic folding, detect open circuits or abnormal resistance points, and evaluate the durability of flexible display and foldable display hinge structures.
2. This machine supports multi-angle (0–180° stepless adjustment) and multi-mode testing (single-sided folding, double-sided folding), accommodating the requirements of various product designs.
3. It allows for the configuration of parameters such as angle, cycle count, and speed, and features conductivity testing, automatic stop-counting upon detection of an open circuit, and automatic origin detection.

Scope of Application for Flexible Material Bending Testers:

1. Flex life testing of flexible displays: Verification of hinge designs for electronic products such as mobile phones, PDAs, electronic dictionaries, and laptops.
2. Durability testing of FPCs: Analysis of mechanical and electrical performance degradation of FFCs under dynamic bending.
3. Comparison of fatigue resistance in emerging flexible materials such as graphene and UTG (ultra-thin glass).
4. Research on failure modes (e.g., delamination and cracking) in composite films (such as PI substrates) after bending.